Project

VIZTA

Vision, Identification, with Z-sensing Technologies and key Applications

Vision, Identification, with Z-sensing Technologies and key Applications

VIZTA project, coordinated by ST Micrelectronics, aims at developing innovative technologies in the field of optical sensors and laser sources for short to long-range 3D-imaging and to demonstrate their value in several key applications including automotive, security, smart buildings, mobile robotics for smart cities, and industry4.0. The key differentiating 12-inch Silicon sensing technologies developed during VIZTA are:

1-Innovative SPAD and lock-in pixel for Time of Flight architecture sensors. 2-Unprecedent and cost-effective NIR and RGB-Z filters on-chip solutions. 3-complex RGB+Z pixel architectures for multimodal 2D/3D imaging.

For short-range sensors : advanced VCSEL sources including wafer-level GaAs optics and associated high speed driver. These developed differentiating technologies allows the development and validation of innovative 3D imaging sensors products with the following highly integrated prototypes demonstrators:

1-High resolution (>77 000 points) time-of-flight ranging sensor module with integrated VCSEL, drivers, filters and optics. 2-Very High resolution (VGA min) depth camera sensor with integrated filters and optics.

For Medium and Long range sensing, VIZTA also adresses new LiDAR systems with dedicated sources, optics and sensors. Technology developments of sensors and emitters are carried out by leading semiconductor product suppliers (ST Microelectronics, Philips, III-V Lab) with the support of equipment suppliers (Amat, Semilab) and CEA Leti RTO.

VIZTA project also include the developement of 6 demonstrators for key applications including automotive, security, smart buildings, mobile robotics for smart cities, and industry4.0 with a good mix of industrial and academic partners (Ibeo, Veoneer, Ficosa, Beamagine, IEE, DFKI, UPC, Idemia, CEA-List, ISD, BCB, IDE, Eurecat). VIZTA consortium brings together 23 partners from 9 countries in Europe: France, Germany, Spain, Greece, Luxembourg, Latvia, Sweden, Hungary, and United Kingdom.

Partners

Universidad Politecnica Catalunya Commisariat a l Energie Atomique et aux Energies Alternatives (CEA Paris) Fundacio Eurecat STMICROELECTRONICS SA BCB Informática y Control Alter Technology TÜV Nord SA FICOMIRRORS SA Philips Photonics GmbH Applied Materials France SARL SEMILAB FELVEZETO FIZIKAI LABORATORIUM RESZVENYTARSASAG ELEKTRONIKAS UN DATORZINATNU INSTITUTS LUMIBIRD IEE S.A. IBEO Automotive Systems GmbH STMICROELECTRONICS RESEARCH & DEVELOPMENT LTD STMICROELECTRONICS SA IDEMIA IDENITY & SECURITY FRANCE Beamagine S.L. Integrated Systems Development S.A. VEONEER SWEDEN AB III-V Lab STMICROELECTRONICS (ALPS) SAS STMICROELECTRONICS GRENOBLE 2 SAS

Sponsors

Federal Ministry of Education and Research (BMBF)

16ESE0424 / GA826600

Federal Ministry of Education and Research (BMBF)

Publications about the project

Jigyasa Singh Katrolia, Jason Raphael Rambach, Bruno Mirbach, Didier Stricker

In: Proceedings of the 16th VISAPP. International Joint Conference on Computer Vision, Imaging and Computer Graphics Theory and Applications (VISIGRAPP-2021) 16th International Joint Conference on Computer Vision, Imaging and Computer Graphics Theory and Applications February 8-10 online Springer 2021.

To the publication
Jigyasa Singh Katrolia, Didier Stricker, Bruno Mirbach, Jason Raphael Rambach,

In: Proceedings of the 28th ICIP. IEEE International Conference on Image Processing (ICIP-2021) September 19-22 Anchorage Alaska United States IEEE 2021.

To the publication
Jigyasa Singh Katrolia, Bruno Mirbach, Jason Raphael Rambach, Didier Stricker

In: British Machine Vision Conference (editor). Proceedings of the. British Machine Vision Conference (BMVC-2021) Online BMVA 2021.

To the publication

German Research Center for Artificial Intelligence
Deutsches Forschungszentrum für Künstliche Intelligenz