In:
49th IEEE International Symposium on Multiple-Valued Logic (ISMVL). IEEE International Symposium on Multiple-Valued Logic (ISMVL-2019) May 21-23 Fredericton New Brunswick Canada 2019.
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In:
Proceedings of ACL 2019. Annual Meeting of the Association for Computational Linguistics (ACL-2019) July 28-August 3 Florence Italy ACL 2019.
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In:
Proceedings of the 14th International Conference on Availability, Reliability and Security. International Conference on Availability, Reliability and Security (ARES-2019) August 26-29 Canterbury United Kingdom ACM ICPS 2019.
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In:
2019 Eleventh International Conference on Quality of Multimedia Experience (QoMEX). International Conference on Quality of Multimedia Experience (QoMEX) June 5-7 Berlin Germany Seiten 1-3 QoMEX IEEE 6/2019.
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In:
2019 Eleventh International Conference on Quality of Multimedia Experience (QoMEX). International Conference on Quality of Multimedia Experience (QoMEX) June 5-7 Berlin Germany Seiten 1-6 QoMEX IEEE 2019.
Zur Publikation
In:
49th IEEE International Symposium on Multiple-Valued Logic (ISMVL). IEEE International Symposium on Multiple-Valued Logic (ISMVL-2019) May 21-23 Fredericton New Brunswick Canada 2019.
Zur Publikation
In:
Proceedings of the 27th European Conference on Information Systems (ECIS). European Conference on Information Systems (ECIS-2019) June 8-14 Stockholm & Uppsala Sweden 185 ISBN 978-1-7336325-0-8 AIS Electronic Library (AISeL) 2019.
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In:
Fortschritte der Akustik - DAGA 2019. Deutsche Jahrestagung für Akustik (DAGA) March 18-21 Rostock Germany Seiten 950-953 DAGA ISBN 978-3-939296-14-0 Deutsche Gesellschaft für Akustik DEGA e.V. 4/2019.
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In:
Tagungsband der 30. Konferenz Elektronische Sprachsignalverarbeitung 2019. Elektronische Sprachsignalverarbeitung (ESSV-2019) March 6-8 Dresden Germany Seiten 134-140 ESSV ISBN 978-3-95908-157-3 TUDpress, Dresden 2019.
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In:
2019 Eleventh International Conference on Quality of Multimedia Experience (QoMEX). International Conference on Quality of Multimedia Experience (QoMEX-2019) June 5-7 Berlin Germany Seiten 1-3 QoMEX IEEE 6/2019.
Zur Publikation
